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Mobile Phone MCP

Consumers are requiring more features and functions for mobile phones now. Manufacturers need to design all within a small space PCB. CSP offers series of mobile phone MCP to satisfy these kinds of design challenges.

Mobile Phone development trend

Products

M71 : NOR + PSRAM
Download this table 1.RQ.=Request
2.Core-Chip: MTK, Infineon, Spreadtrum
Part Number Description FLASH DRAM/RAM Package Outline (mm) Status
Voltage Bus Width Speed Voltage Bus Width Speed
M71PL03280BGW0E0A 32Mb NOR(Top/Bottom Boot) + 8Mb PSRAM 3.3V x16 70ns 3.3V x16 70ns TFBGA 7x9x1.2 RQ.
M71PL032A0BGW0E0A 32Mb NOR(Top/Bottom Boot) + 16Mb PSRAM 3.3V x16 70ns 3.3V x16 70ns TFBGA 7x9x1.2 2010Q1
M71PL064A0BGW0E0A 64Mb NOR(Top/Bottom Boot)+16Mb PSRAM 3.3V x16 96ns 3.3V x16 70ns TFBGA 7x9x1.2 2010Q1
M71PL064B0BGW0E0A 64Mb NOR(Top/Bottom Boot)+32Mb PSRAM 3.3V x16 96ns 3.3V x16 70ns TFBGA 7x9x1.2 2010Q1

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