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Module MCP

It's is very important to manage product life cycle at consumer electronics market now. Manufacturers all expect to design new products with less cost and diversified ID as faster as possible. The idea of modulization can help designers easily complete the process. C. provides series of MCP to be integrated into module products.

Trend of Modulization

Products

CT43 : NAND + SDRAM
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Part Number Description FLASH DRAM/RAM Package Outline (mm) Status
Voltage Bus Width Speed Voltage Bus Width Speed
CT43568SR566A 256Mb NAND+256Mb SDRAM 3.3V x8 50ns 3.3V x16 166MHz FBGA 10x13x1.4 M/P

CT46 : NOR + DDR SDRAM
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2.Core-Chip: Fujitsu
Part Number Description FLASH DRAM/RAM Package Outline (mm) Status
Voltage Bus Width Speed Voltage Bus Width Speed
CT46160BB566 16Mb NOR(Bottom Boot) + 256Mb DDR SDRAM 3.3V x8/x16 70ns 2.5V x16 DDR400 FBGA 10x13x1.4 Ready
CT46320BB566 32Mb NOR (Bottom Boot) + 256Mb DDR SDRAM 3.3V x8/x16 70ns 2.5V x16 DDR400 TFBGA 8x10x1.2 RQ.

CT72 : NOR + M-SDRAM
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2.Core-Chip: T1
Part Number Description FLASH DRAM/RAM Package Outline (mm) Status
Voltage Bus Width Speed Voltage Bus Width Speed
CT72326MT646 32Mb NOR(Multi-Bank,Top Boot)+64Mb M-SDRAM 1.8V x16 70ns 1.8V x16 133MHz FBGA 8x10x1.2 RQ.
CT72646MT646 64Mb NOR(Multi-Bank,Top Boot)+64Mb M-SDRAM 1.8V x16 70ns 1.8V x16 133MHz TFBGA 8x10x1.2 Ready

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