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No	Date	Title
1	2011-01-20	C. Wins 2011 Taiwan Excellence Award
2	2011-01-03	C. Empowers Immediate Imaging Life by RF SiP
3	2010-06-14	C. and Zoran Corporation Announce New Multi-Memory Package
4	2010-06-03	C. Stacks Infinite Power of SiP to Smarten Your Life
5	2009-12-02	C. 4Gb Memory SiP in Mass Production
6	2009-08-17	C. CT83 DDRII stack MCP lead CE products to high-speed era
7	2009-08-02	C. 7th Anniversary Celebrations
8	2009-07-21	CDNLive! TAIWAN 2009 seminar
9	2009-04-07	2009 "C. SiP design forum" seminar
10	2008-12-17	CSP's Office Relocation Notice
11	2008-10-27	P&T/ EXPO COMM CHINA 2008
12	2008-06-03	Computex Taipei 2008
13	2008-05-07	Announced 9x9mm Memory MCP
14	2008-04-18	Cadence SiP Design Forum
15	2008-03-19	PIE (Photo Image Expo) 2008
16	2008-03-15	The provider of SiP integration from component to system
17	2007-10-18	eMex China 2007
18	2007-10-09	KES 2007
19	2006-12-13	C. launches DSC/Camera module/Mobile Phone MCP solutions
20	2006-08-17	EDAT 14th Annual EDA & T
21	2006-07-05	C. signed Korean agency contract with HanChang
22	2006-06-06	2006 Computex Taipei
23	2006-05-16	C. Memory MCP designed in Taiwan major DSC manufacturers
24	2006-01-15	C. signed agency contract with UltraSource
25	2005-10-11	2005 TAITRONICS AUTUMN
26	2005-09-22	Lead free production and compliant with RoHS
27	2005-07-27	EDAT 13th Annual EDA & T
28	2005-05-06	SoC's best substitute - C. SiP ODM design service