Patent & Innovation

HOME > About CSP > Patent & Innovation

As a SiP & MCP leader in Taiwan, C. keeps studying and trying all methods to make SiP and MCP solution smarter and smaller. We many patents for the advanced design and innovation. C. strengthen as well as to join industry-university cooperation and industrial technology development program to intensity the techniques and skills.

C. is a design company offering minimization solution. Either MCP or SiP design, we encourage creating and innovating the newest product. Each design is from C. design team and owns the relative patents especially in the following fields.

1.System in Package
2.RF module
3.Portable device module