SiP Structure Types
According to the different system requirements and the limitation of package dimension, you may have different choices of SiP structure as below.
When SiP integrate dies and packaged IC
A. LF-PoP (Low Profile & Fine Pitch - PoP)
Advantage: The smaller ball pitch and package size than PoP.
B. PoP (Package on Package)
Advantage: Easy to test and verify, and lower yield loss.
Disadvantage: The higher assembly cost and tooling cost.
C.PiP (Package in Package)
Advantage: Package cost lower than PoP.
Disadvantage: Yield control not easy, need to choose KGD (Known Good Die). The higher wafer cost.
When SiP integrate dies only
A. Side-by-Side
Advantage: The smaller package size.
Disadvantage: Thermal effect, and more difficult in substrate design.
B. Stack
Advantage: The higher assembly yield rate and lower cost, easy to design.
Disadvantage: The larger package size.
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