Logic SiP

Memory Wafer Resource
Obtained many memory wafer resouces by strategic partner, CSP provides different memory types and density integration to develop SiP.

Logic SiP
Integrate more than one logic component in a single packaged IC. Such as MCU, ASIC, SoC, DSP, FPGA, CPLD, Memory, etc.

A. Logic + Logic Design
Welcome to consign good dies for SiP stacking design. Otherwise you also can choose packaged logic IC for PiP or PoP design. CSP is also glad to help you sourcing a suitable wafer vendor for SiP business.

B. Memory + Memory Design
We are very experienced in Memory MCP design. And we have many successful design win cases by our own brand MCP in DSC maker in Taiwan. We also provide ODM type business for your requirement of Memory + Memory.

C. Logic + Memory Design
CSP has well prepared for design service of Logic + Memory SiP. We also have strong die resource in various Memory. Welcome for your inquiry, or you could consign good die or utilize packaged IC for your SiP design.