RF Wireless SiP
Application of Wireless SiP
Advantages of C. RF Wireless SiP
- Parallel design process to speed up design cycle.
- Utilize various packaging technologies into one. (FR-4, BT, LTCC, Wire-Bond, Flip-Chip, etc.)
- Easier to assemble and repair.
- Better RF and EMI shielding.
- Higher flexibility for module allocation.
- Lower the difficulties of system module maintenance.
- Overcome the bottleneck of Multi-Frequency integration design.
- Function modulized for easier replacement.
- Higher yield rate, lower yield loss cost.
Smart Phone, PDA, UMPC, PMP, Mobile Internet Device, Portable Navigation Device.
If you need further information about C. RF Wireless Sip, please don't hesitate to contact us. C. is always glad to answer any questions from you. Looking forward to establishing business relationship with you.